COPPER COATED POROUS ALUMINUM BODY AND ITS PRODUCTION

PURPOSE:To produce a heat transfer improver for a hydrogen occluding alloy having superior heat conductivity by coating the surface of a porous Al body having a specified porosity with a specified amount of copper by plating. CONSTITUTION:The surface of a porous Al body having >=90% porosity as a...

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Hauptverfasser:	YAMAMURA KAZUAKI, ISHIKAWA RYOHEI, HONO SHINICHI, KITAMURA HAJIME
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To produce a heat transfer improver for a hydrogen occluding alloy having superior heat conductivity by coating the surface of a porous Al body having a specified porosity with a specified amount of copper by plating. CONSTITUTION:The surface of a porous Al body having >=90% porosity as a base is coated with >=10wt%, preferably >=25wt% copper basing on the amount of the porous Al body by plating, preferably by electroless plating using a reducing agent. Thus, a heat transfer improver for a hydrogen occluding alloy is easily manufactured.