MANUFACTURE OF MINUTE PATTERN SEMICONDUCTOR DEVICE

PURPOSE:To prevent deviation of a pattern after soldering, by elongating film, cooling and hardening the film, providing a lead member having a minute pattern and connecting the member to a semiconductor pellet at a high temperature. CONSTITUTION:Film is elongated, cooled and hardened. A lead member having a minute pattern is provided on the film and connected to a semiconductor pellet by soldering at a high temperature. Namely, in forming the film, elongation treatment corresponding to the difference in the thermal expansion per unit length is performed, and cooling and hardening are performed. Since remaining stress is present in the film, the remaining stress is eased when the film is heated and the film forming temperature is reached. The retained film is contracted. As the sum of the original thermal expansion a nd the contraction of the elongation treatment, the apparent thermal expansion at a solder solidifying temperature can be suppressed to a small value at the time of soldering. The difference in thermal expansions between the lead and a facing material, e.g., silicon, can be suppressed to almost zero. Therefore, the pattern is not deviated between an electrode lead 2 and a silicon pellet 1.