LIGHT EMITTING DIODE

PURPOSE:To efficiently dissipate through an element supporting lead and a Cu-coated lead connected with a bottom by mounting a light emitting diode element on a copper alloy element supporting lead sealed with glass via a through hole of a kovar stem. CONSTITUTION:At least one through hole 18 is formed at a stem 11 made of an Fe-Ni-Co alloy of a package. An element supporting lead 15 made of CuW alloy containing 5-30wt% of Cu, CuMo alloy of CuWMo alloy is passed in noncontacting state with the inner surface of one of the holes, and a light emitting element 14 is mounted directly or through a submount at the top of the lead 16. A Cu-coated iron lead 17 of 50-90% in the sectional area ratio is connected with the bottom of the lead, and a gap between the outer surface of the lead 16 and the inner surface of the hole 18 for passing the lead is hermetically sealed with glass 13.