ELECTROPLATING INSTALLATION

PURPOSE:To inject a plating liquid from upper nozzles and static pressure pads and to plate a steel strip without oscillating the strip by providing the static pressure pads in the intermediate part of the anodes on both sides of the steel strip traveling in a vertical direction and connecting a pla...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TACHIBANA YUKIYOSHI, OKAMOTO SUSUMU, ODA KITO, NOMOTO NOBUO
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PURPOSE:To inject a plating liquid from upper nozzles and static pressure pads and to plate a steel strip without oscillating the strip by providing the static pressure pads in the intermediate part of the anodes on both sides of the steel strip traveling in a vertical direction and connecting a plating liquid supply device to the nozzles provided in the upper part of a plating chamber and the static pressure pads. CONSTITUTION:The steel strip S is run vertically by conductor rolls 31, 32 in a plating cell 1. The strip S passes between a pair of the rectangular plate-shaped anodes 5 consisting of upper electrodes 6 and lower electrodes 7. the static pressure pads 11 are provided on both side at the intermediate of the upper and lower anodes 6 and 7 and the plating liquid is ejected from ejection ports 12 facing upward and horizontal direction. The steel strip is plated while the camber and oscillation thereof are prevented by the static pressure generated during the ejection. The plating liquid is also supplied from auxiliary supply headers 22 in the upper part of the plating chamber 18. The plating liquid is cyclically supplied by supplying the plating liquid E in the bottom of the plating cell 1 to the headers 20 of the pads 11 and the headers 22 by a pump 26. The spacing between the steel strip and the anodes is thus decreased and the plating with the smaller electric power is made possible.