WAFER ALIGNER FOR SEMICONDUCTOR DEVICE
PURPOSE:To enable processing of high accuracy, high efficiency, and high quality by removing effects of thermal rays, i.e. thermal effects, by a method wherein station multiplication is contrived by dividing a series of works, and the alignment station is separated from the exposure station. CONSTIT...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To enable processing of high accuracy, high efficiency, and high quality by removing effects of thermal rays, i.e. thermal effects, by a method wherein station multiplication is contrived by dividing a series of works, and the alignment station is separated from the exposure station. CONSTITUTION:Cassettes 1 containing wafers 8 can be set each in a wafer loader section 20 and a wafer unloader section 21. A wafer supply belt 22 to take the wafers 8 one by one out of this cassette 1 and a wafer containment belt 23 to put the wafers 8 one by one into the cassette 1 are provided in continuity to the wafer loader section 20 and the wafer unloader section 21. The top of an index table 25 is provided with three work stations, i.e. three carriers 26 corresponding to a load-unload station (a), an alignment station (b), and an exposure station (c). The first and second vacuum hoses 27, 28 to actuate a vacuum adsorption means as the holding mechanism are connected to each carrier 26, and the other ends thereof are connected to a vacuum rotary joint 29. |
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