THERMOSETTING EPOXY RESIN VARNISH

PURPOSE:To provide the titled varnish for multi-layer printed circuit board, giving a cured resin having excellent uniformity, heat-resistance and strength, etc., by compounding a specific linear high-molecular cresol-novolac resin, an epoxy resin and a solvent at specific ratios. CONSTITUTION:The o...

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Bibliographische Detailangaben
Hauptverfasser:	NAKANO YOSHITOMO, KADA MASUMI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the titled varnish for multi-layer printed circuit board, giving a cured resin having excellent uniformity, heat-resistance and strength, etc., by compounding a specific linear high-molecular cresol-novolac resin, an epoxy resin and a solvent at specific ratios. CONSTITUTION:The objective varnish can be produced by compounding (A) a linear high-molecular cresol-movolac resin soluble in methanol and acetone, having a number-average molecular weight of >=1,500 measured by the vapor- pressure method using methyl ethyl ketone as the solvent, and selected from o-cresol-novolac resin and o-cresol/p-cresol random copolymerized novolac resin having a copolymerized o-cresol/p-cresol ratio of >=50/50, with (B) an epoxy resin having >=2 epoxy groups in one molecule and (C) a solvent. The amount of the epoxy group in the component B is 0.5-1.5 equivalent per 1 equivalent of the OH group of the component A, and the amount of the component C is 10-1,000pts.wt. per 100pts.wt. of the sum of the components A and B.