INSPECTING APPARATUS OF WAFER

PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism....

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: AKAGAWA KATSUYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator AKAGAWA KATSUYUKI
description PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPS61168236A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPS61168236A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPS61168236A3</originalsourceid><addsrcrecordid>eNrjZJD19AsOcHUO8fRzV3AMCHAMcgwJDVbwd1MId3RzDeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmhoZmFkbGZo7GxKgBAJ98IW0</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INSPECTING APPARATUS OF WAFER</title><source>esp@cenet</source><creator>AKAGAWA KATSUYUKI</creator><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><description>PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19860729&amp;DB=EPODOC&amp;CC=JP&amp;NR=S61168236A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19860729&amp;DB=EPODOC&amp;CC=JP&amp;NR=S61168236A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><title>INSPECTING APPARATUS OF WAFER</title><description>PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD19AsOcHUO8fRzV3AMCHAMcgwJDVbwd1MId3RzDeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmhoZmFkbGZo7GxKgBAJ98IW0</recordid><startdate>19860729</startdate><enddate>19860729</enddate><creator>AKAGAWA KATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>19860729</creationdate><title>INSPECTING APPARATUS OF WAFER</title><author>AKAGAWA KATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS61168236A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1986</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKAGAWA KATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSPECTING APPARATUS OF WAFER</title><date>1986-07-29</date><risdate>1986</risdate><abstract>PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPS61168236A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
title INSPECTING APPARATUS OF WAFER
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T01%3A54%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AKAGAWA%20KATSUYUKI&rft.date=1986-07-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPS61168236A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true