INSPECTING APPARATUS OF WAFER
PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism....
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creator | AKAGAWA KATSUYUKI |
description | PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism. |
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CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>1986</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860729&DB=EPODOC&CC=JP&NR=S61168236A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19860729&DB=EPODOC&CC=JP&NR=S61168236A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><title>INSPECTING APPARATUS OF WAFER</title><description>PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1986</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD19AsOcHUO8fRzV3AMCHAMcgwJDVbwd1MId3RzDeJhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAcFmhoZmFkbGZo7GxKgBAJ98IW0</recordid><startdate>19860729</startdate><enddate>19860729</enddate><creator>AKAGAWA KATSUYUKI</creator><scope>EVB</scope></search><sort><creationdate>19860729</creationdate><title>INSPECTING APPARATUS OF WAFER</title><author>AKAGAWA KATSUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPS61168236A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1986</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AKAGAWA KATSUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKAGAWA KATSUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSPECTING APPARATUS OF WAFER</title><date>1986-07-29</date><risdate>1986</risdate><abstract>PURPOSE:To obtain a wafer inspecting apparatus having a loading mechanism used in common and requiring a reduced area for installation, by providing a plurality of stage mechanisms for inspecting wafers and by distributing the wafers to each stage mechanism by means of the single loading mechanism. CONSTITUTION:Vibration-insulating mechanisms 2 and 3 are provided on a frame element 1. A right-hand inspecting element is composed of a base 4, an XY stage 6, a Z stage 6, a theta rotation stage 7, a probe card 9, a support 10, a microscope 11 and a sensor 13 which detects the position of a chip formed on a wafer 8. A left-hand inspecting element is composed of a base 14, an XY stage 15, a Z stage 16, a theta rotation stage 17, a probe card 19, a support 20, a microscope 21 and a sensor 22. The inspecting elements are supported by the vibration-insulating mechanism 2 and 3 respectively. A control unit 23 is provided with a microcomputer 23a comprising an arithmetic processing element, a memory element and an I/O element, and drives and controls the stages 5-7 and 15-17, a conveyor mechanism for wafer carriers, and a wafer loading mechanism.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
title | INSPECTING APPARATUS OF WAFER |
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