SEMICONDUCTOR DEVICE

PURPOSE:To enable easily detecting moisture infiltrated on the surface of a chip by the change of the resistance value between wirings by providing humidity sensors at least in a part of the surface of the chip, the wirings of the sensors being placed near and exposed through the aperture of a passivation. CONSTITUTION:A chip 5 has a various construction internal circuit 8 at the center and many electrode pads 9 are provided at the periphery. Six humidity sensors 10 in total are provided in a part of the surface of the chip 5, e.g., at the four corners and on the middle member of the long edge. Al wirings 11a, 11b each connected to different electrode pads 9a, 9b are placed near at the position of the humidity sensors 10 and on these, a passivation 12 such as a silane film is formed and the wirings are exposed in an aperture made in a part of the passivation.