GLASS COMPOSITION

PURPOSE:A glass composition for ceramic bonding, having high bond strength between ceramic and ceramic or ceramic and metal, and small reduction in bond strength even at specific high temperature, having a specified composition. CONSTITUTION:A glass composition for ceramic bonding comprising (A) 100...

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Bibliographische Detailangaben
Hauptverfasser:	KONAGA NORIYUKI, ZAIRI YASUNORI, AKAI YOSHITO, MORITSU YUKIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE CEMENTS CERAMICS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LIME, MAGNESIA METALLURGY MINERAL OR SLAG WOOL REFRACTORIES SLAG SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	PURPOSE:A glass composition for ceramic bonding, having high bond strength between ceramic and ceramic or ceramic and metal, and small reduction in bond strength even at specific high temperature, having a specified composition. CONSTITUTION:A glass composition for ceramic bonding comprising (A) 100pts. wt. at least one powder of TiN, TiB2, AlN, AlB2, BN, B4C, SiC, and Si3N4, (B) 20-160pts. wt. SiO2 powder, (C) 1-600pts. wt. B2O3 powder, and (D) 1-1,600pts. wt. at least one of (R1)2O, (R2)O, (R3)O2 and (R4)2O2(R1 is Na, K, or Li; R2 is Mg, Ca, Ba, Zn, Pb, or Cd; R3 is Ti, Zr, or Mn; R4 is Al, or bi). This composition is laid between target materials, and heat-treated to give a bonded material having high bond strength the bonded material has characteristics of approximately no reduction in bond strength even if it is heated to 400-1,000 deg.C high temperature.