JOINING METHOD OF METAL

PURPOSE:To form a joint part having an extremely good quality level by brazing a base material which is to be joined on the surface to be adhered of which an Ni plating film controlled to high purity is formed in an atmosphere where an impurity is not diffused into the film then joining said materia...

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Bibliographische Detailangaben
1. Verfasser:	HAMAMURA KIYOTO
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To form a joint part having an extremely good quality level by brazing a base material which is to be joined on the surface to be adhered of which an Ni plating film controlled to high purity is formed in an atmosphere where an impurity is not diffused into the film then joining said material. CONSTITUTION:W paste as the base material to be joined is printed on one surface of a ceramic substrate and is calcined at about 1,500 deg.C to form a metallized substrate which is then dipped in about 50% heated hydrochloric acid to remove the impurity. The Ni plating film is formed to abou 1mu on the metallized layer of W on the ceramic substrate under pescribed plating conditions and is heat- treated for about 10min in a hydrogen atmosphere kept at about 900 deg.C to expel the gaseous impurity. The substrate is thereafter brazed by silver solder composed of silver and copper in an atmosphere kept at about 830 deg.C. The purity of hydrogen in this stage is preferably high. The joint part of the brazed substrate is joined by a welding means such as electric welding or laser welding.