SEMICONDUCTOR DEVICE

PURPOSE:To improve reliability regarding the damp-proofing of a molding package device by forming a conductor wiring metallic layer on approximately the whole surface of the uppermost layer of a device. CONSTITUTION:A conductor wiring metal 1 is pattern on a substrate 10, and a passivation film 2 is...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SAKATANI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!