LEAD FRAME

PURPOSE:To prevent a solder from flowing out by providing a through hole at a portion connected with an electrode. CONSTITUTION:A through hole 21a is formed at the end of the lead piece 21 of a lead frame provided on a carrier tape 1. The hole 21a is formed smaller than a projecting electrode 31 on...

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Bibliographische Detailangaben
Hauptverfasser:	UNNO TASUKU, KIYONO MASAMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent a solder from flowing out by providing a through hole at a portion connected with an electrode. CONSTITUTION:A through hole 21a is formed at the end of the lead piece 21 of a lead frame provided on a carrier tape 1. The hole 21a is formed smaller than a projecting electrode 31 on a semiconductor chip 3. The portion of the hole 21a is contacted with the electrode 31 to be heated, thereby bonding the piece 21 with the electrode 31 by a solder layer, and an excess solder layer 21a is collected in the hole 21a to eliminate the flow of the solder to the edge of the chip 3. Accordingly, a shortcircuit defect when the lead frame is bonded can be prevented.