ELECTRIC CONNECTION STRUCTURE AND FORMATION THEREOF

@ This invention relates to an electrical interconnection for connecting conductive layers and to a method for fabricating such devices. The interconnections (7) can be made from normal metal, superconductors, low bandgap insulators, semimetals or semiconductors depending on the application, and form vias between the conductive layers.After the formation of contamination cones (3) on a substrate (2), a first conductive layer (4) is deposited on a portion of a cone and over the substrate. An insulating material (6) is deposited conformally over the conductive layer (4) and cone (3) such that the thickness of the insulating matenal over the conductive layer has a thickness less than the height of the contamination cone. Those portions of the insulation material, the conductive layer and the contamination cone which extend beyond the nominal surface of the insulating layer are removed, exposing a portion of the cone and a portion of the conductive layer which forms an interconnection (7). In a final step, another layer (5) of conductive material is deposited such that an electrically conductive interconnection (7) is made between the just deposited conductive layer (5) and the initially deposited conductive layer 1(4).