METHOD FOR PREVENTING ADHESION OF PLATING METAL TO ELECTROPLATING CURRENT SUPPLY ROLL

PURPOSE:To perform uniform plating by surely preventing the adhesion of a plating metal to a current supply roll 3, by arranging a plating metal adhesion inhibiting body in close vicinity of an electroplating current supply roll positioned in a plating solution and applying a current to said body. CONSTITUTION:In horizontal electroplating for performing plating by supplying a current to a material 1 to be plated, which is passed between plating electrodes 2, 2' provided in a plating solution 9 in an opposed state, from a current supply roll 3, a plating metal adhesion inhibiting body 5 constituted so as to recirculate an electrolyte such as 10% H2SO4 solution to the gap formed by an anion exchange membrane 6 and an electrode 7 is arranged in close vicinity to the current supply roll 3 and the material 1 to be plated and a current is supplied between the plating adhesion inhibiting body 5 and the current supply roll 3. By this mechanism, the surface of the current supply roll 3 is always activated to be prevented from the adhesion of the plating metal and, even if the plating metal is precipitated onto the current supply roll 3, it is removed by the application of a current and dissolved in the plating solution 9.