METHOD FOR PREVENTING ADHESION OF PLATING METAL TO ELECTROPLATING CURRENT SUPPLY ROLL

PURPOSE:To perform uniform plating while keeping the supply of a current to a material to be plated well by certainly preventing the adhesion of a plating metal to a current supply roll, by forming air bubbles in a plating solution in close vicinity to the current supply roll positioned in the plati...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUZUKI TAKAO, NAKAYAMA MOTOHIRO, MURAKAMI NOBUKAZU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To perform uniform plating while keeping the supply of a current to a material to be plated well by certainly preventing the adhesion of a plating metal to a current supply roll, by forming air bubbles in a plating solution in close vicinity to the current supply roll positioned in the plating solution. CONSTITUTION:In horizontal electroplating for performing the plating of a material 1 to be plated, which passes between a current supply roll 3 and a back- up roll 4 and is transferred through a plating solution 5 in which plating electrodes 2, 2' are provided, by supplying a current through the above mentioned current supply roll 3, a nozzle 6 is provided in the plating solution 5 in close vicinity of the current supply roll 3 and gas such as air is blown out to the region of the roll 3 in the plating solution 5 to form air bubbles 7. By this mechanism, the electric resistance of the plating solution 5 in the vicinity of the roll 3 is increased to inhibit the current to the roll 3 from a part other than the contact part of the current supply roll 3 with the material 1 to be plated 1 and the adhesion of the plating metal to the current supply roll 3 is certainly prevented.