COATING METHOD OF TITANIUM CARBIDE THICK FILM

PURPOSE:To apply a thick titanium carbide film to a substrate in good close adhesiveness, by adjusting the internal stress of the titanium carbide film by changing voltage applied to the substrate corresponding to the accumulated film thickness of titanium carbide. CONSTITUTION:In applying a thick t...

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Hauptverfasser:	MIZOGUCHI TADANORI, WATANABE KAZUHIRO, ITOU YUTAKA, MURAKAMI YOSHIO, SAGAWA NORIMOTO, ABE TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOUNDS THEREOF DIFFUSION TREATMENT OF METALLIC MATERIAL FUSION REACTORS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INORGANIC CHEMISTRY METALLURGY NON-METALLIC ELEMENTS NUCLEAR ENGINEERING NUCLEAR PHYSICS PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE:To apply a thick titanium carbide film to a substrate in good close adhesiveness, by adjusting the internal stress of the titanium carbide film by changing voltage applied to the substrate corresponding to the accumulated film thickness of titanium carbide. CONSTITUTION:In applying a thick titanium carbide film to a substrate by a physical vapor deposition method, constant voltage of minus 150-250V is applied to the substrate at the beginning of coating to perform the positive draw- in of a titanium ion and the close adhesiveness of the substrate with the titanium carbide film is enhanced. When the titanium carbide film having good close adhesiveness reaches several mum, voltage to be applied is gradually lowered until 1-2mum is further accumulated to be brought to minus 5V or less. Thereafter, voltage is constantly held at minus 5V or less until vapor deposition is finished to form the objective film thickness. By this method, the titanium carbide film with a thickness of several mum or more is formed on the substrate in good close adhesiveness.