CURABLE SULFONIC ACID RESIN COMPOSITION AND PARTICLE

PURPOSE:The titled composition which has a low curing temperature and whose degree of curing can be easily controlled and which is easily formed into particles, comprising a specified addition polymer of 2-(meth)acrylamide-2-methylpropanesulfonic acid and an epoxy compound, and particles thereof. CO...

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Bibliographische Detailangaben
1. Verfasser:	MIYAKAI TAKUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PURPOSE:The titled composition which has a low curing temperature and whose degree of curing can be easily controlled and which is easily formed into particles, comprising a specified addition polymer of 2-(meth)acrylamide-2-methylpropanesulfonic acid and an epoxy compound, and particles thereof. CONSTITUTION:The titled composition is obtained by contacting (A) a curable sulfonic acid resin which is an addition (co)polymer containing at least 10mol% structural repeating units comprising groups derived from 2-(meth)acrylamide-2- methylpropanesulfonic acid with (B) at least 1.25wt%, based on component A, polyepoxy compound (e.g., ethylene glycol diglycidyl ether) at 20-200 deg.C, or titled particles (particle diameter of 0.5-30mum) of the composition are obtained by dissolving a mixture of components A and B in a solvent of a b.p. of 0-80 deg.C, dispersing the solution in water containing a surfactant to form a dispersion of drops of a particle diameter of 0.5-30mum, heating the dispersion to 40-120 deg.C to remove the dispersing medium and filtering and drying the product.