MANUFACTURE OF IC CARD

PURPOSE:To obtain an extremely thin IC card by a method wherein a lead frame serves not only as a supporting means of an IC chip but also as a connecting means of the IC chip and the summation of the thickness of the lead frame and the thickness of a molded resin is to be the thickness of the IC car...

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Bibliographische Detailangaben
1. Verfasser:	SAITOU TAMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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