MANUFACTURE OF IC CARD

PURPOSE:To obtain an extremely thin IC card by a method wherein a lead frame serves not only as a supporting means of an IC chip but also as a connecting means of the IC chip and the summation of the thickness of the lead frame and the thickness of a molded resin is to be the thickness of the IC car...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SAITOU TAMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain an extremely thin IC card by a method wherein a lead frame serves not only as a supporting means of an IC chip but also as a connecting means of the IC chip and the summation of the thickness of the lead frame and the thickness of a molded resin is to be the thickness of the IC card. CONSTITUTION:A metal plate of a thickness of 0.2mm. or less, preferrably about 0.05mm., is introduced as a lead frame plate and punched out into a prescribed form. An outside frame is composed of a supporting frame 3 and a plurality of electrode parts 4, a bonding pad part 1 for IC chip mounting supported by arms 2a and 2b, a battery mounting pad part 6 supported by arms 7a and 7b and connected to the pad part 1 by a connecting part 8 and a loop antenna part 5 are formed inside the outside frame. An IC chip is mounted on the pad part 1 and a battery is mounted on the pad part 6 and respective wirings are made. Then front and back sides of the part shown by two-dot chain lines is covered with a molded resin 11 and this part is cut off.