ELECTRICALLY CONDUCTIVE, LOW-SHRINKAGE RESIN MOLDING MATERIAL
PURPOSE:To provide the titled resin molding material which has good moldability and gives moldings having excellent electrical conductivity and mechanical strength, by blending a small quantity of a specified electrically conductive material with a low-shrinkage resin compsn. contg. an unsaturated p...
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| creator | NARISAWA SHIGEYUKI KAWADA YASUAKI |
| description | PURPOSE:To provide the titled resin molding material which has good moldability and gives moldings having excellent electrical conductivity and mechanical strength, by blending a small quantity of a specified electrically conductive material with a low-shrinkage resin compsn. contg. an unsaturated polyester resin as a base. CONSTITUTION:Finely divided electrically conductive carbon black having a specific surface area of 500m /g or above such as Ketjen black EC having a specific surface area of 1,000m /g or above (a product of Lion-Akzo K.K.) is used as an electrically conductive material. 0.5-5wt% (based on the total quantity of molding material) said electrically conductive material is blended with a low- shrinkage resin compsn. consisting of an unsaturated polyester such as Upika 7500 (a product of Nippon Upika K.K.), a low-shrinking agent such as a styrene soln. of polymethyl methacrylate, a reinforcing agent such as chopped glass strand having a diameter of several tens of microns, a filler such as aluminum hydroxide and a polymn. initiator such as butyl perbenzoate. |
| format | Patent |
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CONSTITUTION:Finely divided electrically conductive carbon black having a specific surface area of 500m /g or above such as Ketjen black EC having a specific surface area of 1,000m /g or above (a product of Lion-Akzo K.K.) is used as an electrically conductive material. 0.5-5wt% (based on the total quantity of molding material) said electrically conductive material is blended with a low- shrinkage resin compsn. consisting of an unsaturated polyester such as Upika 7500 (a product of Nippon Upika K.K.), a low-shrinking agent such as a styrene soln. of polymethyl methacrylate, a reinforcing agent such as chopped glass strand having a diameter of several tens of microns, a filler such as aluminum hydroxide and a polymn. initiator such as butyl perbenzoate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>1985</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850419&DB=EPODOC&CC=JP&NR=S6069158A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19850419&DB=EPODOC&CC=JP&NR=S6069158A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NARISAWA SHIGEYUKI</creatorcontrib><creatorcontrib>KAWADA YASUAKI</creatorcontrib><title>ELECTRICALLY CONDUCTIVE, LOW-SHRINKAGE RESIN MOLDING MATERIAL</title><description>PURPOSE:To provide the titled resin molding material which has good moldability and gives moldings having excellent electrical conductivity and mechanical strength, by blending a small quantity of a specified electrically conductive material with a low-shrinkage resin compsn. contg. an unsaturated polyester resin as a base. 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CONSTITUTION:Finely divided electrically conductive carbon black having a specific surface area of 500m /g or above such as Ketjen black EC having a specific surface area of 1,000m /g or above (a product of Lion-Akzo K.K.) is used as an electrically conductive material. 0.5-5wt% (based on the total quantity of molding material) said electrically conductive material is blended with a low- shrinkage resin compsn. consisting of an unsaturated polyester such as Upika 7500 (a product of Nippon Upika K.K.), a low-shrinking agent such as a styrene soln. of polymethyl methacrylate, a reinforcing agent such as chopped glass strand having a diameter of several tens of microns, a filler such as aluminum hydroxide and a polymn. initiator such as butyl perbenzoate.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | ELECTRICALLY CONDUCTIVE, LOW-SHRINKAGE RESIN MOLDING MATERIAL |
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