ELECTRICALLY CONDUCTIVE, LOW-SHRINKAGE RESIN MOLDING MATERIAL

PURPOSE:To provide the titled resin molding material which has good moldability and gives moldings having excellent electrical conductivity and mechanical strength, by blending a small quantity of a specified electrically conductive material with a low-shrinkage resin compsn. contg. an unsaturated polyester resin as a base. CONSTITUTION:Finely divided electrically conductive carbon black having a specific surface area of 500m /g or above such as Ketjen black EC having a specific surface area of 1,000m /g or above (a product of Lion-Akzo K.K.) is used as an electrically conductive material. 0.5-5wt% (based on the total quantity of molding material) said electrically conductive material is blended with a low- shrinkage resin compsn. consisting of an unsaturated polyester such as Upika 7500 (a product of Nippon Upika K.K.), a low-shrinking agent such as a styrene soln. of polymethyl methacrylate, a reinforcing agent such as chopped glass strand having a diameter of several tens of microns, a filler such as aluminum hydroxide and a polymn. initiator such as butyl perbenzoate.