CONTROLLING METHOD OF SEMICONDUCTOR RESIN SEALING DEVICE
PURPOSE:To enable to make an exchange of metal molds without the medium of manpower by a method wherein a demountable signal is made to generate in case of demounting a metal mold, while a mounting-end signal is made to generate in case of mounting a metal mold. CONSTITUTION:Signals to indicate the...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To enable to make an exchange of metal molds without the medium of manpower by a method wherein a demountable signal is made to generate in case of demounting a metal mold, while a mounting-end signal is made to generate in case of mounting a metal mold. CONSTITUTION:Signals to indicate the operating states of incidental units 13-1- 13-n are given. An incidental control unit 14 gives operating signals to the incidental units 13-1-13-n on the basis of these signals given from the incidental units 13-1-13-n and a signal from a Sequence control unit 12. Also, the Sequence control unit 12 is given the indicating signal of an operator inputted from an operator station through a mode change-over switch 15 or a remote indicating signal from the incidental control unit 14. When the mode change-over switch 15 is selecting the A side, the demounting of an old metal mold and the mounting of a new metal mold are made on the judgement of the operator, because the selective instruction of operation and the Sequence starting instruction are given by the operator, while when the mode change-over switch 15 is selecting the B side, the selection of Sequence operation and the starting instruction are made by the incidental control unit 14. |
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