POSITIONING MECHANISM OF FLAT PACKAGE TYPE SEMICONDUCTOR DEVICE

PURPOSE:To position the titled semiconductor device excellently in a high-temperature test equipment by mounting both-side guides, which are narrowed in the direction of transfer and progress of the semiconductor device and position the left and right directions, and a stopper positioning the before and behind directions to the position of the end section of a transfer rail. CONSTITUTION:A feed-pawl 14 feeding LSIs 13 is formed on a transfer rail 4, and the LSIs 13 are positioned accurately at a final end, and fed to a measuring section 8 by a rotary table 7. The left and right positions of the LSIs 13 are limited by the tapered side walls of both-side guides 15 in a process through which the LSIs are transferred by the transfer rail 4, and the cut surfaces of leads for the LSIs 13 are brought into contact with the side walls of both-side guides 15 at the position of the final end of the transfer rail 4 and the positions of the LSIs 13 are determined. Positions in the before and behind directions of the LSIs 13 are determined because the cut surfaces of the leads for the LSIs 13 are stopped by a stopper 16.