TEST EQUIPMENT AT HIGH TEMPERATURE OF SEMICONDUCTOR DEVICE

PURPOSE:To control a temperature with high efficiency by arranging a hot nozzle blowing in hot air for partial heating in a carrying section and/or a measuring section for a semiconductor device to be tested. CONSTITUTION:A heating furnace 5 approximately consists of an upper furnace 5a, a lower furnace 5b and a slit plate 5c, and a plurality of slits are formed to the slit plate 5c so that hot air from a hot nozzle 12 uniformly collides with a plurality of LSIs 13 on a transfer rail 4. A thermocouple 14 is inserted into the furnace to detect a temperature, and the temperature in the furnace is controlled. The length of the heating furnace 5 is related to the speed of carrying of the transfer rail 4, and it is necessary to have length only of retention for approximately one min in the furnace of the LSIs placed on the transfer rail 4.