AROMATIC POLYESTERAMIDE FILM

PURPOSE:To obtain titled film with excellent heat resistance, electrical insulation, formability, etc., by copolymerization between aromatic dicarboxylic acid compound, specific aromatic hydroxyamino compound and aromatic dihydroxy compound. CONSTITUTION:The objective film consisting mainly of such...

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Bibliographische Detailangaben
Hauptverfasser:	OBARA TEIJI, OOBA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE:To obtain titled film with excellent heat resistance, electrical insulation, formability, etc., by copolymerization between aromatic dicarboxylic acid compound, specific aromatic hydroxyamino compound and aromatic dihydroxy compound. CONSTITUTION:The objective film consisting mainly of such polyesteramide that the structural units of formulae I -III (R are each H, halogen, alkyl or alkoxy; Ar is aromatic group; the -CO- group in the formula III being attached to ortho- and/or meta-site) are bonded through ester- or amido-bond one another and the number ratio of the structural units I /II falls between 95/5 and 10/90 can be obtained by copolymerization between (A) terephthalic and/or isophthalic acid or its (their) derivative(s) (B) a compound of formula IV and (C) a compound of formula V followed by forming into film. This film is useful for general-purpose packaging, and as magnetic tapes, spacers, especially heat-resistant electrical insulation films.