JPS6042614B

PURPOSE:To enable miniaturizing of a container by using a bonding capillary wherein the max. external diameter is made constant from the tip to a specified length and is thinner than the other portion. CONSTITUTION:A bonding capillary 16 is made the max. diameter of 0.6mm. from the tip 17 of the bon...

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Bibliographische Detailangaben
Hauptverfasser:	FUKUI YOSHIAKI, KOSHO JOJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PURPOSE:To enable miniaturizing of a container by using a bonding capillary wherein the max. external diameter is made constant from the tip to a specified length and is thinner than the other portion. CONSTITUTION:A bonding capillary 16 is made the max. diameter of 0.6mm. from the tip 17 of the bonding portion extending by 0.9mm. toward the direction of a metal wire hole. The capillary 16 is enabled to bond without touching a wall 13 adjacent to the bonding portion 12 of a semiconductor device container due to the thin shape of the tip. Consequently, an unnecessary bonding area can be eliminated and a semiconductor device can be miniaturized. Since the tip of the capillary 16 is made thin, the bonding capillary can easily be coincided with a spot of illumination.