JPS6032355B

PURPOSE:To extract a center gate electrode correctly and steadily by a method wherein the electrode is drawn out almost vertically upward by means of a fine copper wire, the chip is covered, the fine copper wire is inserted in a copper pipe, the base of the pipe and the entire chip and molded, and the fine copper wire and the copper pipe are caulked lastly. CONSTITUTION:A fine copper wire 10 applied with surface treatment is used for a lead from gate electrode, which is drawn out almost vertically upward to a chip. Next, the chip and its connection are covered with a gelationus resin varnish or silicon rubber 11 for protection. Then, the fine copper wire 10 is inserted in a copper pipe 12 applied with surface treatment, and a resin case 13 is installed on the periphery. Next, the entire chip including the base whereat the pipe 12 is inserted is molded in the interior of case 13, and a fluidized resin 14 thermosetting or self- curing is poured therein to hardening, thereby binding the pipe 12 firmly. Next, the fine wire 10 and the pipe 12 are connected electrically through caulking mechanically to form an externally-drawn electrode 15.