THICK FILM HYBRID IC

PURPOSE:To produce the titled hybrid IC easily without fail by a method wherein conductive patterns for connecting each terminal of thick film element are divided at specified interval and after measuring and adjusting the element, chip- type mold parts with dammy electrode bridge over the patterns....

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Bibliographische Detailangaben
1. Verfasser:	SATOU KIKUO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESISTORS SEMICONDUCTOR DEVICES
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