ADHESION METHOD

PURPOSE:To realize powerful adhesion without the sticking of dust or parts by adhering a molded product after making non-viscous the exposed part which is not involved in the adhesion of a pressure-sensitive adhesive layer of photo cross- linking type coated on a plate. CONSTITUTION:One hundred weig...

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Bibliographische Detailangaben
Hauptverfasser:	SATSUMA MICHIO, IJICHI ICHIROU, KAMEI KIYOHIRO, MATSUSHITA KIYOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PURPOSE:To realize powerful adhesion without the sticking of dust or parts by adhering a molded product after making non-viscous the exposed part which is not involved in the adhesion of a pressure-sensitive adhesive layer of photo cross- linking type coated on a plate. CONSTITUTION:One hundred weight parts of adhesive base polymer (e.g. butadiene polymer), 0.01-20 weight parts of photo cross-linking sensitizer (e.g. benzophenon) and if necessary, 0.1-20 weight parts of photo activity cross-linking agent (e.g. N,N'-methylenebisacrylamid) and 20-100 weight parts of viscosity index improver (e.g. phenolic terpene resin) are formulated and then are resolved in an organic solvent, thus obtaining a pressure-sensitive adhesive of photo cross- linking type. Next, the afore-mentioned adhesive is applied on plate-like objects such as synthetic resin and glass, and then an active beam having a wave length of 1,500-6,000Angstrom is projected onto an exposed part not involved in the adhesion to make said part non-viscous. After this process, a molded product made up of metallic or synthetic resin frame is caused to adhere to the part.