CREAM SOLDER

PURPOSE:To hold uniformly solder particles and flux components without sepn. by consisting cream solder of a flux contg. a resin which dissolves in the solvent of the flux at an ordinary temp. and a resin having limitation in the solubility and solder powder. CONSTITUTION:The structure in which a re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MURAKAMI SHIYUUICHI, MURAKISHI ISAO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To hold uniformly solder particles and flux components without sepn. by consisting cream solder of a flux contg. a resin which dissolves in the solvent of the flux at an ordinary temp. and a resin having limitation in the solubility and solder powder. CONSTITUTION:The structure in which a resin 4 having the solubility limit in the solvent at an ordinary temp. exists spottedly in the resin 2 dissolving thoroughly in the solvent at an ordinary temp. and in which the surface of the resin 4 is softened by the effect of the solvent and has weak tack is formed. As a result, the solder particles dispersed uniformly in the flux do not settle and the sepn. of the solder particles and the flux is obviated. The resin having the solubility limit with the solvent at an ordinary temp. dissolves thoroughly at the melting temp. of the solder and therefore the flux 5 mixed uniformly with the resin and activator covers the periphery of the solder particles 1. Soldering is thus executed as in the conventonal manner.