PREPARATION OF ULTRASONIC PROBE

PURPOSE:To prevent the disturbance in the arrangement of a piezoelectric vibrator, by strengthening the fixation of the piezoelectric vibrator not only at the cutting processing time of a piezoelectric vibration plate but also at the press bonding time of an acoustic matching layer. CONSTITUTION:A p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: DOI TOSHIKATSU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To prevent the disturbance in the arrangement of a piezoelectric vibrator, by strengthening the fixation of the piezoelectric vibrator not only at the cutting processing time of a piezoelectric vibration plate but also at the press bonding time of an acoustic matching layer. CONSTITUTION:A piezoelectric vibration plate 5 and a dummy plate 6 having high rigidity are adhered by heat-meltable wax 7. After grooves 3 are provided to be piezoelectric vibration plate 5 integrated with the dummy plate 6 by cutting processing, the piezoelectric vibrator 1 split by grooves 3 is bonded and fixed to an ultrasonic absorber 2. Next, the heat-meltable wax 7 is softened by heating to detach the dummy plate 6 from the piezoelectric vibrator 1 and, thereafter, a resin 8 is penetrated in and allowed to fill the grooves 3 in such a state that the heat-meltable wax 7 was adhered and cured to fix the piezoelectric vibrator 1. After the heat-meltable wax 7 is removed by a solvent, an acoustic matching layer 4 is adhered to the piezoelectric vibrator 1 under pressure. By this constitution, the deformation of the ultrasonic absorber and the disturbance in the arrangement of the ultrasonic absorber and the disturbance in the arrangement of the piezoelectric vibrator can be prevented not only at the cutting processing time of the piezoelectric vibration plate but also at the bonding time of the acoustic matching layer.