MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To enable to prevent the lowering of yield of production by a method wherein a resin sealing is performed by fixing the post part of a bonding-lead- connected lead frame at the position higher than the disc part on whic a semiconductor pellet is mounted, thereby enabling to prevent the lead frame from coming into with the bonding lead. CONSTITUTION:The semiconductor pellet 11 formed on a circuit network is mounted on the disc 16 of a lead frame 12, and a bonding pad part and the post 15 of the lead frame 12 are connected using a bonding lead 17 such as a gold wire, for example. The lead frame 12 whereon the above-mentioned bonding connection is performed is set on the cavity part 13 located in a resin sealing metal mold 21. As a result, the face of the post 15 of the lead frame 12 is fixed at the position higher than the surface of the disc 16. Subsequently, the fused resin 14 such as epoxy and the like is filled in the cavity part 13 of the resin sealing metal mold 21 as shown by the arrow (a) in the diagram, and the semiconductor pellet 11 containing the post 15 of the lead frame 12, the disc 16 and the bonding lead 17 is sealed by resin.