SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

PURPOSE:To reduce the amount of working hours in processing an insulation film which covers the wiring of semiconductive element by a method wherein a layer interposed insulation film and the like, which is performed patterning process, is obtained by a photosensitive polyimide resin by patterning and by heat- treatment of a polyimide system resin. CONSTITUTION:A semiconductive element 12 is formed on a main surface of semiconductive substrate 1 and single or plural layers 14, which are connected to this semiconductive element 12, are formed and then an insulation film 16 covers between these wiring layers or/and on the wiring layer. In the processes that a part of this insulation film 16 is treated to obtain connection between wiring layers or a part of the wiring layer is exposed, a photosensitive polyimide is used in at least a part of the insulation film 16, and the photosensitive polyimide is processed before curing. By doing this, the amount of working hours is reduced as well as eliminating damage from the wiring during the insulation film processing.