POLYAMIDE MOLDING COMPOSITION

The invention relates to thermoplastic moulding compositions consisting of (A) 65-97% by weight of a polyamide and (B) 3-5% by weight of a graft rubber having a gel content of at least 50% by weight and a glass transition temperature below -20 DEG C., the sum of the components A and B being 100% by...

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Hauptverfasser: RUUTOUITSUHI TORABERUTO, GEERUTO KURISUTOFU, RUDORUFU BINZATSUKU, GUNTAA BERUNTO BEEBAA, KURISUCHIYAN RINDONAA, YOZEFU MERUTEN, YURUGEN HINTSU, HAINRITSUHI HAUPUTO
Format: Patent
Sprache:eng
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Zusammenfassung:The invention relates to thermoplastic moulding compositions consisting of (A) 65-97% by weight of a polyamide and (B) 3-5% by weight of a graft rubber having a gel content of at least 50% by weight and a glass transition temperature below -20 DEG C., the sum of the components A and B being 100% by weight, containing 0.1-1% by weight, preferably 0.25-0.8% by weight, relative to the sum of A and B, of tetrafluoroethylene polymers, and to a process for their preparation.