CAPILLARY TIP FOR WIRE BONDING

PURPOSE:To make it possible to perform stitch bonding of a copper wire to a copper lead and to decrease the amount of material, by specifying the range of the surface roughness of the tip compressing part of a capillary tip. CONSTITUTION:The surface roughness of the tip compressing part of a capilla...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	HIROTA SANEYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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