CAPILLARY TIP FOR WIRE BONDING

PURPOSE:To make it possible to perform stitch bonding of a copper wire to a copper lead and to decrease the amount of material, by specifying the range of the surface roughness of the tip compressing part of a capillary tip. CONSTITUTION:The surface roughness of the tip compressing part of a capilla...

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Bibliographische Detailangaben
1. Verfasser:	HIROTA SANEYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE:To make it possible to perform stitch bonding of a copper wire to a copper lead and to decrease the amount of material, by specifying the range of the surface roughness of the tip compressing part of a capillary tip. CONSTITUTION:The surface roughness of the tip compressing part of a capillary tip is made to be located within a range of Rz=0.8-2.0mum. In order to obtain such surface roughness, e.g., emery paper is polished, or burning is performed when the capillary is manufactured so that the specified surface roughness is obtained. Thus the friction coefficient between the capillary tip 5 and the copper wire 6 is increased. Therefore, sufficient slippage is obtained between the copper wire 6 and the copper lead 4 at the intial stage of bonding. An oxide film and the like are broken and removed by this way and the strong bonding can be obtained.