SUBSTRATE POSITIONING DEVICE

PURPOSE:To enable to position correctly a substrate of wafer, etc. with a simple construction by a method wherein referential members for positioning are provided transferrably to a base. CONSTITUTION:After a wafer W is put on a holder 2, referential members 30, 40 are sent out according to air cylinders 50. Then an air cylinder 45 is operated to press the circumferential edge of the wafer W to the directions of the members 30, 40 according to a press member 46. Then coming in contact of the member 46 with the edge surface of the wafer W is released, and the operations of the cylinders 50 are suspended, the members 30, 40 are turned out from the holder 2, and coming in contact of rollers 31a, 31c, 41b (or rollers 31b, 41a, 41c) with the wafer W is released. The wafer W repositioned in such a way is conveyed up to the directly under side of a projection lens, for example, according to a stage 1, the two dimensional position in relation to a projection image is prescribed, and correction of the slippage of a rotation is also performed.