BONDABLE POLYETHYLENE RESIN COMPOSITION

PURPOSE:To provide the titled resin compsn. which can be bonded to metal at a low temp. in a short time, consisting of a molten mixture consisting of a modified high-density polyethylene, a modified linear low-density polyethylene and a metallic compd. powder. CONSTITUTION:1-30pts.wt. modified high-...

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Bibliographische Detailangaben
Hauptverfasser: TANAKA MOTONORI, TOYOSHIMA YOSHIKI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PURPOSE:To provide the titled resin compsn. which can be bonded to metal at a low temp. in a short time, consisting of a molten mixture consisting of a modified high-density polyethylene, a modified linear low-density polyethylene and a metallic compd. powder. CONSTITUTION:1-30pts.wt. modified high-density polyethylene (A) contg. 0.05- 2wt% unsaturated carboxylic acid anhydride (e.g. maleic anhydride) component obtd. by melt-modifying a high-density polyethylene having a density of 0.95 or above, 99-70pts.wt. modified linear low-density polyethylene (B) contg. 0.001- 1wt% unsaturated carboxylic acid anhydride component obtd. by melt-modifying a linear low-density polyethylene such as an ethylene/alpha-olefin copolymer having a density of 0.915-0.94 and 0.01-5pts.wt. powder (C) of an oxide or a hydroxide of a Group II metal such as calcium oxide or magnesium hydroxide are mixed together by melting.