COPOLYESTER RESIN COMPOSITION

PURPOSE:The titled resin composition injection-moldable at relatively low temperatures economically, obtained by incorporating a reinforcing filler, a salt of a polymer containing carboxyl groups, and a polyalkylene glycol compound into a copolyester resin having a specified composition. CONSTITUTIO...

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Bibliographische Detailangaben
Hauptverfasser:	OKUNO KENJI, TANIGUCHI TOSHIROU, TAKAMOTO KATSUNORI, YOKOTA SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PURPOSE:The titled resin composition injection-moldable at relatively low temperatures economically, obtained by incorporating a reinforcing filler, a salt of a polymer containing carboxyl groups, and a polyalkylene glycol compound into a copolyester resin having a specified composition. CONSTITUTION:100pts.wt. copolyester resin (A) containing a terephthalic acid component, an ethylene glycol component, and 1-20wt% polyalkylene glycol component with an average molecular weight of 400-20,000, 10-140pts.wt. reinforcing filler (B) (e.g. silica), 0.05-20pts.wt. Na or K salt of a polymer containing carboxyl groups (C), and 0.1-10pts.wt. polyalkylene glycol compound (D) of the formula (where R1 and R1' are each H or a lower alkyl; R2 is an alkylene of 2-4C; n is 5 or greater) (e.g. polypropylene glycol) are compounded to give an objective copolyester resin composition.