MANUFACTURE OF SEMICONDUCTOR DEVICE

PURPOSE:To reduce number of alignment marks per actual tip and increase the yield rate of obtaining tips per wafer by using a method of regarding plural number of tips as one tip. CONSTITUTION:When an interval of alignment marks in a device is assumed as L, each width of plural number of semiconduct...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MIYOSHI HIROKAZU, NISHIMOTO AKIRA, NAKAJIMA MORIYOSHI, TAKAHASHI HIROSHIGE, ANDOU AKIRA, MATSUNO YOUKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To reduce number of alignment marks per actual tip and increase the yield rate of obtaining tips per wafer by using a method of regarding plural number of tips as one tip. CONSTITUTION:When an interval of alignment marks in a device is assumed as L, each width of plural number of semiconductor tips to be continuously formed in a line on a semiconductor wafer is assumed as l0 and the width of the alignment mark is assumed as DELTA, L=nl+W [n is a positive integer, l0