NOVEL POLYMERIC COMPOUND HAVING LOW FLEXIBILITY AND ITS PREPARATION

PURPOSE:To obtain the titled novel compound having high heat resistance, suitable as a modifying material of a vinyl polymer, and having a main chain consisting of C-C bond and a side chain containing cyclopentyloxycarbonyl group, by polymerizing dicyclopentyl fumarate. CONSTITUTION:The novel polyme...

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Hauptverfasser: TOYODA NAOYUKI, OOTSU TAKAYUKI, MURATA TAKASHIGE, ANAMI KEIZOU
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To obtain the titled novel compound having high heat resistance, suitable as a modifying material of a vinyl polymer, and having a main chain consisting of C-C bond and a side chain containing cyclopentyloxycarbonyl group, by polymerizing dicyclopentyl fumarate. CONSTITUTION:The novel polymeric compound contaning the recurring unit of formula and having a number-average molecular weight of preferably 5,000- 300,000 is produced by the radical polymerization of dicyclopentyl fumarate preferably in the presence of a radical polymerization initiator such as an organic peroxide, azo compound, etc. EFFECT:A novel compound having excellent heat resistance and alkali resistance can be produced easily without by-producing undesirable low-molecular compounds (e.g. water, carbon dioxide gas, etc.).