RESIN SEALED TYPE SEMICONDUCTOR DEVICE

PURPOSE:To obtain the titled device of high reliability by a method wherein a supporting member at the intermediate section of junction wires is provided between a supporting substrate for a semiconductor element and connection leads separated from a lead frame. CONSTITUTION:The junction wires 4 for the electrodes of the semiconductor elemenet 1 with leads 3 are supported on the supporting member 8 of frame form surrounding the supporting substrate 2 with an insulating adhesive 9. The upper surface of the member 8 is formed evenly with that of the leads 3, and the member 8 is supported by a pair of bars 10 and 11 provided between leads 3. The substrate 2 is located lower than the member 8 and the connection leads 3 and supported by a pair of obliquely-downward joint members 12 and 13 projecting out to the inner periphery of the member 8. The fifference (d) is level between the lower surface of the substrate 2 and that of the member 8 may be 0.3-0.4mm.. An insulation resin can be used instead of the adhesive 9. Besides, it is advisable to make a conductive pattern as the relay point of connection by adhering an insulator having this pattern onto the supporting member 8. This construction enables the production of the titled device of high reliability by preventing various kind of hindrances due to the deflection of connection.