PRETREATING SOLUTION FOR SILVER PLATING

PURPOSE:To prevent the substitution depositon of silver and to form a fine silver film when a substrate of a metal which is baser than silver is electroplated with silver, by pretreating the substrate with a soln. contg. thiocaroxylic acid or a salt thereof. CONSTITUTION:This pretreating soln. for s...

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Bibliographische Detailangaben
Hauptverfasser:	MORI YASUO, OOKUBO RIICHI, KASAI SHIYUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the substitution depositon of silver and to form a fine silver film when a substrate of a metal which is baser than silver is electroplated with silver, by pretreating the substrate with a soln. contg. thiocaroxylic acid or a salt thereof. CONSTITUTION:This pretreating soln. for silver plating is an aqueous soln. contg. thiocarboxylic acid or a salt thereof. A substrate of a metal which is baser than silver such as a copper (alloy) substrate or a copper plated substrate is dipped in the pretreating soln. before the surface of the substrate is electroplated with silver. The substitution deposition of silver is prevented, and a fine silver film is formed by electroplating.