MANUFACTURE OF WAFER FOR SCREENING AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To realize low-priced and highly reliable ICs and HICs (hybrid integrated circuit devices) by a method wherein, before pellets are assembled and mounted, a screening is carried out for the pellets in the state of a wafer by conduction, and after that, the initial defectives of the pellets ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NODA YUUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!