MANUFACTURE OF WAFER FOR SCREENING AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

PURPOSE:To realize low-priced and highly reliable ICs and HICs (hybrid integrated circuit devices) by a method wherein, before pellets are assembled and mounted, a screening is carried out for the pellets in the state of a wafer by conduction, and after that, the initial defectives of the pellets are removed and the assembling yield of the ICs and HICs are upgraded. CONSTITUTION:A screening 2 of 31 is carried out for a wafer, which ended a diffusion 11 and a wiring 12 by conduction, and after that, an electric characteristic test 1 of 13 is carried out for the wafer and whether the wafer is a non-defective or a defective for the use of pellet is decided, and after that, the wafer is made a pellet division 14, the initial defectives of pellets are removed and an IC assembling 15 and an HIC assembling 16 is performed for non-defective pellets only. An electric characteristic test 2 of 18 removes defective pellets at the times of the pellet division 14, the IC assembling 15 and the HIC assembling 16 and tests the electric characteristics of non-defective pellets essential as a final product.