ELECTROLESS IRIDIUM PLATING BATH

PURPOSE:To improve the stability of a plating soln. and to increase the rate of plating and the rate of utilization of iridium by adjusting the soln. contg. iridium halide, hydrazine and hydroxylamine salt to a prescribed pH. CONSTITUTION:An electroless iridium plating bath contg. iridium halide and...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TORIKAI EIICHI, KAWAMI YOUJI, NAGAYA KIICHI, TAKENAKA HIROTAKA, NAKA YUKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE:To improve the stability of a plating soln. and to increase the rate of plating and the rate of utilization of iridium by adjusting the soln. contg. iridium halide, hydrazine and hydroxylamine salt to a prescribed pH. CONSTITUTION:An electroless iridium plating bath contg. iridium halide and hydrazine or further contg. hydroxylamine salt is adjusted to 3-10pH. The plating bath is very stable, and when it is used, the rate of plating is very high, the rate of utilization of iridium is high, and even a nonmetallic material can be plated.