MANUFACTURE OF SUPERCONDUCTIVE MULTIPLAYER WIRING
PURPOSE:To contrive the reduction in stepwise difference of each electrode pattern by a method wherein a double-film of a heat-resisting polymer resin film and an inorganic film is used for an interlayer insulation film. CONSTITUTION:A ground plane 22 is adhered on an Si substrate 21, and the interl...
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Zusammenfassung: | PURPOSE:To contrive the reduction in stepwise difference of each electrode pattern by a method wherein a double-film of a heat-resisting polymer resin film and an inorganic film is used for an interlayer insulation film. CONSTITUTION:A ground plane 22 is adhered on an Si substrate 21, and the interlayer insulation film 23 made of polyimide series resin is formed thereon. Next, the lower electrode 24 patterned is formed thereon. Then, interlayer insulation films 26 and 31 having an aperture over the electrode 24 made of polyimide series resin 26 and SiO2 31 are formed on the film 23 and the electrode 24. A tunnel junction 25 is formed in the exposed part of the electrode 24; thereafter, the upper electrode 27 is formed in the upper part. Interlayer insulation films 28 and 32 made of a double-layer of polyimide resin 28 and SiO2 32 are formed on the electrode 27. A through hole reaching the electrode 27 is formed through the films 28 and 32. A control electrode 29 is formed over them, and finally a protection film 30 is formed. The manufacture as above enables quasiplanarization and eliminates all the step cuts in each layer due to steep stepwise differences, resulting in the large impovement in operating margin. |
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