PLATING METHOD

PURPOSE:To form a film having high covering power and superior toughness by forming in advance a metallic film on an insulating substrate with a chemical plating soln. and carrying out electroplating on the metallic film as an underlayer. CONSTITUTION:A film having high covering power is formed on a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUZUKI YOSHIHIRO, WAJIMA MOTOYO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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