PLATING METHOD

PURPOSE:To form a film having high covering power and superior toughness by forming in advance a metallic film on an insulating substrate with a chemical plating soln. and carrying out electroplating on the metallic film as an underlayer. CONSTITUTION:A film having high covering power is formed on a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI YOSHIHIRO, WAJIMA MOTOYO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PURPOSE:To form a film having high covering power and superior toughness by forming in advance a metallic film on an insulating substrate with a chemical plating soln. and carrying out electroplating on the metallic film as an underlayer. CONSTITUTION:A film having high covering power is formed on an insulator by chemical plating, and electroplating is carried out on the film as an underlayer to form a dense and uniform film having high strength and toughness. The electroplating is carried out by a pulse plating method, and the resulting film is most suitable for a printed circuit board having through holes.