VACUUN CHUCK

PURPOSE:To provide the wafer absorbing and holding function and flat surface by using sintered metal for the chuck surface for absorbing substrates. CONSTITUTION:In a chuck case-body 11, a sintered metal plate 10 is used as the substrate absorbing plate 1, and a vacuum suction hole 12 is drilled ont...

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Bibliographische Detailangaben
1. Verfasser:	SATOU KATSUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS MANIPULATORS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS SEMICONDUCTOR DEVICES TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FORFASTENING, CONNECTING, DISENGAGING OR HOLDING TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE:To provide the wafer absorbing and holding function and flat surface by using sintered metal for the chuck surface for absorbing substrates. CONSTITUTION:In a chuck case-body 11, a sintered metal plate 10 is used as the substrate absorbing plate 1, and a vacuum suction hole 12 is drilled onto the back surface side. Therefore, a number of gas holes peculiar to the sintered metl body are uniformly formed onto the absorbing plate 1 of the vacuum chuck, and the force for absorbing a loaded wafer as working object from the back surface side is generated. Therefore, the captioned chuck is provided with the strain correcting function for the held wafers, together with the holding fuction for the substrate such as wafers.